Other specifications of packaging can be provided according to customer requirements
Ultra-High Purity Disilane Si2H6 100.00% Electronic Gas
Ultra-High Purity Disilane Si2H6 100.00% Electronic Gas
Technical Specifications
1. Basic Information
| Item | Specification |
|---|---|
| Product Name | Disilane |
| Formula | Si2H6 |
| CAS NO | 1590-87-0 |
| Purity | 100.00% |
| Capacity | 100 T/Y |
| Package | 47L Cylinder, DISS632 Valve |
2. Physical and Chemical Properties
| Property | Value |
|---|---|
| Appearance and properties | Colorless, extremely flammable gas |
| Melting point (°C) | -132.5 |
| Boiling point (°C) | -14.3 |
| Vapor density (air = 1) | ~2.15 |
| Flash point (°C) | Pyrophoric (Ignites spontaneously in air) |
| Flammability | Extremely Flammable / Pyrophoric |
| Solubility | Insoluble in water (reacts slowly); slightly soluble in organic solvents |
Packaging & Delivery
Due to its pyrophoric nature, Disilane requires the highest level of packaging integrity:
- Cylinders: Premium 47L seamless cylinders, internally treated to prevent surface reactions and maintain 100% purity.
- Valve Technology: Specifically equipped with ultra-high integrity DISS632 valves. The DISS (Diameter Index Safety System) connection guarantees exceptional leak integrity, crucial for highly reactive and pyrophoric semiconductor gases.
- Shipping: Handled strictly by specialized hazardous materials logistics experts with rigorous safety protocols.
Why Choose Us?
- Absolute 100.00% Purity: We achieve the pinnacle of gas purification. Our Disilane allows chipmakers to deposit flawless silicon layers at much lower temperatures compared to traditional silane (SiH4), preventing thermal damage to advanced microchips.
- Advanced DISS Valve Standard: Utilizing DISS632 connections ensures that your facility can integrate our cylinders with maximum safety and zero contamination risk.
- Rare Manufacturing Capability: A 100 T/Y capacity for 100% pure Disilane demonstrates our advanced R&D and chemical engineering prowess, making us a strategic partner for top-tier fabs.
Applications
Disilane is indispensable for manufacturing the newest generation of microprocessors and memory chips:
- Low-Temperature Epitaxy: Enables faster deposition rates of silicon and silicon-germanium layers at significantly lower temperatures than monosilane.
- Atomic Layer Deposition (ALD): Ideal for highly conformal deposition of silicon dioxide and silicon nitride in complex 3D chip architectures (like 3D NAND).
- Photovoltaics: Used to create highly efficient amorphous silicon layers in advanced solar cell technologies.
