I-High-Purity Liquid Argon kwi-Semiconductor Manufacturing kunye ne-Procurement Guide
Ngophuhliso olukhawulezayo lweshishini le-semiconductor yehlabathi, iinkqubo zokwenziwa kwe-chip zingene ngokupheleleyo kwixesha le-nanometer. Kule nkqubo yokwenziwa ichane kakhulu, nakuphi na ukuguquguquka kwemekobume okanye ukungcola okubonakalayo kunokukhokelela ekuchithweni kwebhetshi yonke yeewafers. Ke ngoko, iigesi ezikhethekileyo ze-elektroniki kunye neegesi ezisulungekileyo kwimizi-mveliso zidlala indima engenakuthathelwa indawo. Phakathi kwabo, ubunyulu obuphezulu be-argon yolwelo iye yaba yeyona nto ibalulekileyo enokutyiwa kwimisebenzi yemihla ngemihla yelaphu le-semiconductor ngenxa yokungasebenzi kakuhle kweekhemikhali kunye neempawu ezibalaseleyo zomzimba.
Eli nqaku liza kuhlalutya nzulu izicelo ezingundoqo ze-argon yolwelo kwiinkqubo zokwenziwa kwetshiphu kwaye ibonelele ngesikhokelo sokuthengwa kwempahla kumaqela obonelelo lweshishini.
Usetyenziso olungundoqo: Kutheni i-Liquid Argon ingenakuhlukaniswa kwi-Semiconductor Manufacturing?
Kwi-Front-End-of-Line (FEOL) inkqubo yokuvelisa i-semiconductor, i-argon yolwelo yee-semiconductors isetyenziswa ikakhulu kula manqanaba angundoqo alandelayo amisela imveliso yemveliso:
- Ukubekwa koMphunga woMzimba (PVD) / ukuSputtering: Igesi ye-argon ecocekileyo, eyenziwe yi-gasification ye-argon yolwelo, yeyona gesi isebenzayo kwiinkqubo ze-PVD zokutshiza. Kwigumbi le-vacuum, ii-ion ze-argon zikhawuleziswa yintsimi yombane ukuze ibhobhoze into ekujoliswe kuyo, ibangela ukuba ii-athomu ezijoliswe kuzo zikhuphe kwaye zifake ngokulinganayo kumphezulu we-wafer ukwenza ifilimu yesinyithi. Ucoceko oluphezulu luyimfuneko yokuqinisekisa ukuxinana kunye nokuhambelana kombane wefilimu.
- Ukhuseleko ngokupheleleyo kwimo engqongileyo eKhuselayo: Ngethuba lenkqubo yokutsala i-silicon ye-monocrystalline (njengenkqubo ye-Czochralski) kunye neenkqubo zokushisa eziphezulu zokushisa, i-silicon isabela ngokulula nge-oksijini kwiqondo lokushisa eliphezulu. Ke ngoko, irhasi ye-argon kufuneka iqhubeke yaziswa ukuze ithathe indawo yomoya, ibonelela ngemekobume engasebenziyo ngokupheleleyo eyodwa kwioksijini kunye nokufuma, ngaloo ndlela iqinisekisa ukukhula okugqibeleleyo kwe-silicon crystal lattice.
- Itekhnoloji yokucoca iCryogenics kunye neWafer: Kwiinkqubo eziphambili ezifana ne-Extreme Ultraviolet (EUV) lithography, iimpawu ze-ultra-low zeqondo lokushisa kwe-argon yolwelo (indawo yokubilisa -186 ° C) ngamanye amaxesha isetyenziswe kwiinkqubo zokupholisa zezixhobo ezichanekileyo. Kwangaxeshanye, itekhnoloji ye-argon ye-aerosol isetyenziselwa ukucoca i-nanometer-scale physical micro-clean kwi-wafer surfaces, enokuthi isuse ngokungonakalisi i-particulate miniti.
Umgangatho Umisela iSivuno: Imigangatho engqongqo ye-High-Purity Liquid Argon
Iimfuno zeshishini le-semiconductor zemathiriyeli ekrwada ziqatha kakhulu. I-argon yolwelo oluqhelekileyo lwe-industrial-grade i-argon idla ngokufuna ukufikelela kucoceko lwe-99.9% okanye i-99.99%, kodwa oku kude nokuhlangabezana neemfuno zokwenza i-chip. Kuba abafanelekileyo ulwelo olusulungekileyo argon, ukucoceka kwesiseko ngokuqhelekileyo kufunwa ukufikelela kwi-99.999% (5N), kwaye kwiindawo eziphambili, kufuneka zifikelele kwi-99.9999% (6N) okanye ngaphezulu.
Okubaluleke ngakumbi kukulawula ukungcola. Umxholo weoksijini, initrogen, ukufuma, iihydrocarbons zizonke (THC), kunye nee-ion zesinyithi zokulandelela kufuneka zilawulwe ngokungqongqo kwinqanaba le-ppb (iinxalenye ngebhiliyoni nganye) okanye nakwi-ppt (iinxalenye ngetriliyoni nganye). Nokuba isixa somzuzu sobumdaka sixuba kumbhobho werhasi, siyakwenza iziphene ezincinci kumphezulu we-wafer, obangela iisekethe ezimfutshane zetshiphu okanye ukuvuza kwangoku, kutsale ngokuthe ngqo umlinganiselo wesivuno kwaye kuzise ilahleko enkulu yezoqoqosho.
Isikhokelo sokuThengwa kweeMpahla: UVavanya njani kwaye ukhethe uMboneleli weArgon oyiNgcali yoLiquid?
Ukunikezelwa kwendima eqinisekileyo yeegesi ezicocekileyo ekusebenzeni kwemigca yemveliso, ukufumana nokukhusela umboneleli we-argon engamanzi ofanelekileyo kwaye okwaziyo ngumsebenzi ongundoqo wokuthengwa kwempahla kunye namaqela okubonelela. Xa uvavanya ababoneleli abanokubakho, kuyacetyiswa ukuba ugxininise kule miba mithathu ilandelayo:
Ulawulo loMgangatho olungqongqo kunye neZakhono zoVavanyo: Ababoneleli abagqwesileyo kufuneka baxhotyiswe ngezixhobo zokuhlalutya umkhondo womkhondo okumgangatho ophezulu onjengeGas Chromatographs (GC) kunye neMass Spectrometers (MS). Kufuneka babe nakho ukubonelela nge-COA eneenkcukacha (iSatifikethi sokuHlalutya) kwibhetshi nganye ukuqinisekisa ukuhambelana ngokupheleleyo ekucocekeni phakathi kokuhanjiswa.
UZinzo oluluqilima lwesiXeko soNikezo kunye noZinzo loNikezo: IiFabs zihlala zisebenza nge-24/7/365, kwaye iindleko zexesha lokuphumla ziphezulu kakhulu. Ke ngoko, ababoneleli kufuneka babe nesakhono esikhulu sokugcina ulwelo lwasekhaya, iilori zabo zeetanki ze-cryogenic, kunye nezicwangciso ezibanzi zemeko engxamisekileyo yoqinisekiso lobonelelo olungxamisekileyo.
Izikhongozeli ezikwinqanaba eliphezulu kunye neTekhnoloji echasene “nongcoliseko lweSibini”: Kungakhathaliseki ukuba i-gas icocekile kangakanani, ayinamsebenzi ukuba ingcolile ngexesha lokuthutha. Ugxininiso kufuneka lube kwiitanki zokugcina i-cryogenic kunye ne-tanker yangaphakathi yonyango yodonga lweteknoloji (ezifana nokuba sele ifumene unyango lwe-Electropolishing / EP), kunye neeNkqubo zokuSebenza eziMgangatho (SOP) zokucoca ivalve kunye nemibhobho ngexesha lokuzaliswa kunye nokudluliselwa kwezigaba, ukuqinisekisa ukuba ukucoceka okuphezulu kunokuhanjiswa ngokuthe ngqo ukusuka kwisikhululo ukuya kwi-terminal yomthengi.
Ukuqukumbela
Ngaphantsi kokuqhubela phambili okuqhubekayo koMthetho kaMoore, i-argon yolwelo olucocekileyo oluphezulu aluyiyo nje into esetyenziswayo esisiseko, kodwa "i-escort engabonakaliyo" kwiinkqubo eziphambili ze-semiconductor. Ukuphonononga ngokwenzululwazi nangokungqongqo nokukhetha a umboneleli we-argon engamanzi ngamandla abanzi okuqinisekisa unikezelo olukumgangatho ophezulu kunye noluzinzileyo lwe-argon engamanzi kwii-semiconductors lilitye lembombo kwishishini ngalinye lokuvelisa i-semiconductor ukuphucula isivuno senkqubo kunye nokuphumelela kukhuphiswano lwemarike yehlabathi.
FAQ
I-Q1: Ingqongqo kangakanani ulawulo lokungcola kwi-argon ephezulu yolwelo olucocekileyo olusetyenziswa kwimveliso ye-semiconductor?
Impendulo: Ungqongqo kakhulu. I-argon yolwelo lwe-Semiconductor ayifuni kuphela ukucoceka okupheleleyo kwe-99.999% (5N) okanye ngaphezulu, kodwa ngokubaluleke kakhulu, ibeka imida engqongqo kwizinto ezingcolileyo ezithile. Ngokomzekelo, amanqanaba omswakama (H2O) kunye ne-oksijeni (O2) ahlala efunekayo ukuba agcinwe ngaphantsi kwe-10 ppb; kwi-7nm kunye nangaphantsi kwee-nodes eziphambili, ukungcola kwe-ion yensimbi kudinge i-ppt-level (iinxalenye ngetriliyoni nganye) ulawulo.
I-Q2: Xa ukhetha umthengisi we-argon we-liquid, unokuthintelwa njani ukungcola okwesibini ngexesha lokuthutha kunye nokudluliselwa?
Impendulo: Isitshixo sokuthintela ukungcoliseka kwesibini silele kwisixhobo se-hardware somthengisi kunye neenkcukacha zokusebenza. Ngexesha lokuthengwa kwempahla, qinisekisa ukuba umthengisi usebenzisa i-high-cleanline cryogenic tankers ezinikezelwe kwi-semiconductors (i-liner yangaphakathi idinga ukupolishwa okukhethekileyo kunye nokugqithisa). Ngeli xesha, jonga kwakhona i-SOP yabo yokothula ulwelo kwisiza, uqinisekisa ukucocwa kwerhasi ephezulu yococeko kunye nokutshintshwa kwayo kwenziwa phambi kokuba kudityaniswe imibhobho, kwaye izixhobo zokujonga ioksijini/ukufuma kwi-intanethi zinezixhobo.
I-Q3: Nguwuphi umonakalo onokuthi ubangele kwi-wafer ukuba i-argon ye-liquid ye-semiconductors ayihambelani nemigangatho yokucoceka?
Impendulo: Ukuba ucoceko lukumgangatho ophantsi (njengokuxutywa ne-oksijini yomkhondo okanye ukufuma), kuya kubangela ukuphendulwa kwe-oxidation yomhlaba engalindelekanga kwii-silicone wafers ngexesha lobushushu obuphezulu be-annealing okanye iinkqubo zokutsalwa kwekristale. Kwi-PVD i-sputtering, ukungcola kuya kuxubana kwifilimu yensimbi efakwe, ukuguqula i-resistivity yefilimu kunye neempawu ezibonakalayo. Ezi ziya kubangela ngokuthe ngqo iziphene ezibulalayo ezifana neesekethe ezimfutshane kunye neesekethe ezivulekileyo kwi-wafer, ukunciphisa kakhulu isivuno se-chip.
