Semiconductor manufacturing relies on a wide variety of gases, which can be categorized into three main types: roj, Cov Khoom Siv Tshwj Xeeb, and etching gases. These gases must be of extremely high purity to prevent contamination, which can ruin the delicate and complex fabrication process.

Bulk Gases

Nitrogen (n₂):

Lub luag haujlwm: N₂ pabcuam ntau lub hom phiaj, suav nrog cov txheej txheem lim kom huv thiab muab cov cua inert auticonductor tsim khoom.
Additional Notes: Nitrogen is often employed in the transport and storage of silicon wafers to minimize oxidation. Its inert nature ensures that it does not react with other materials, making it ideal for maintaining clean processing environments.

Argon (ar):
Role: In addition to its involvement in plasma processes, argon is instrumental in processes where controlled gas compositions are crucial.
Cov Lus Cim Ntxiv: vim tias nws tsis hnov ​​qab nrog cov ntaub ntawv feem ntau, argon tseem siv rau kev tso tawm hlau lossis dielectric cov yeeb yaj kiab uas yuav tsum tau tswj hwm yam uas tsis muaj kev paug.

Helium (He):
Role: Helium’s thermal properties make it invaluable for cooling and maintaining temperature consistency during reactive processes.
Cov Lus Cim Ntxiv: Feem ntau siv nyob rau hauv high-zog laser laser tshuab rau lithography vim nws cov peev xwm tsis muaj kev tswj hwm txoj kev kho kom tsis muaj kev sib kis.

Hydrogen (H₂):
Lub luag haujlwm: Tshaj dhau nws daim ntawv thov hauv Annealing, Hydrogen tseem pab kev ntxuav lub npoo ntawm wafers thiab tuaj yeem koom nrog tshuaj lom neeg cov kev coj ua.
Cov Lus Cim Ntxiv: kev siv hydrogen hauv cov yeeb yaj kiab nyias nyias tso cai rau kev tswj cov khoom siv ntau dua nyob rau hauv cov ntaub ntawv slicamonductor, kho lawv cov hluav taws xob.

Specialty Gases and Dopants

Silane (SiH₄):
Lub luag haujlwm: Sib nrug los ua ib tug ua ntej ua tus ua ntej rau Silicon Deposition, silane tuaj yeem ua yeeb yaj kiab passivating uas txhim kho cov yam ntxwv hluav taws xob.
Additional Notes: Its reactivity requires careful handling due to safety concerns, particularly when mixed with air or oxygen.

Ammonia (NH₃):
Lub luag haujlwm: ntxiv rau kev tsim cov nitride zaj duab xis, Ammonia tseem ceeb nyob rau hauv kev tsim cov nyiaj passivation uas txhim kho kev ntseeg tau ntawm semicondility ntawm semicondility ntawm semicondility ntawm semiconductor cov cuab yeej siv.
Additional Notes: It can be involved in processes that require nitrogen incorporation into silicon, improving electronic properties.

Phosphine (PH₃), Arsine (AsH₃), and Diborane (B₂H₆):
Lub luag haujlwm: cov roj av no tsis yog qhov tseem ceeb rau doping tab sis kuj tseem tseem ceeb rau kev ua tiav cov khoom siv hluav taws xob zoo hauv cov khoom siv semiconductor siab.
Additional Notes: Their toxicity necessitates strict safety protocols and monitor systems in fabrication environments to mitigate hazards.

Etching and Cleaning Gases

Fluorocarbons (CF₄, SF₆):
Role: These gases are employed in dry etching processes, which offer high precision compared to wet etching methods.
Cov Lus Cim Ntxiv: CF₄ thiab SFO tseem ceeb vim lawv lub peev xwm los Etch cov khoom siv silicon-based zoo, tso cai rau cov qauv zoo qauv tseem ceeb hauv cov microelectronics niaj hnub.

Chlorine (Cl₂) and Hydrogen Fluoride (HF):
Role: Chlorine provides aggressive etching capabilities, especially for metals, while HF is crucial for silicon dioxide removal.
Cov Lus Cim Ntxiv: kev sib xyaw ua ke rau cov roj av no tso cai rau cov txheej txheem tshem tawm thaum ntau qhov chaw ua kom huv si rau cov kauj ruam kev ua tiav.

Nitrogen Trifluoride (NF₃):
Role: NF₃ is pivotal for environmental cleaning in CVD systems, responding with contaminants to maintain optimal performance.
Cov Lus Cim Ntxiv: Kev txhawj xeeb txog nws cov roj av muaj peev xwm ua rau kev tu ua kom nws qhov kev siv tau xav tau kev ceev faj ib puag ncig.

Cov pa (O₂):
Role: The oxidation processes facilitated by oxygen can create essential insulating layers in semiconductor structures.
Cov Lus Qhia Ntxiv: Oxygen lub luag haujlwm hauv kev txhim kho Oxidation ntawm silicon los ua cov txheej sudicon yog qhov tseem ceeb rau kev sib cais thiab kev tiv thaiv ntawm cov khoom sib xyaw Circuit Court.

Emerging Gases in Semiconductor Manufacturing

In addition to the traditional gases listed above, other gases are gaining attention in the semiconductor manufacturing process, including:

Cov pa roj carbon dioxide (CO₂): Used in some cleaning and etching applications, particularly those involving advanced materials.

Silicon Dioxide (SiO₂): Though not a gas under standard conditions, vaporized forms of silicon dioxide are utilized in certain deposition processes.

Ib puag ncig kev txiav txim siab

Lub semiconductor kev lag luam tau tsom mus rau txo cov pa hluav taws xob ib puag ncig cuam tshuam nrog kev siv ntau cov uas muaj zog tsev cog khoom roj. Qhov no tau coj mus rau txoj kev txhim kho cov tshuab tswj roj siab thiab kev tshawb nrhiav ntawm lwm cov roj uas tuaj yeem muab cov kev sib tw ib puag ncig.

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The gases used in semiconductor manufacturing play a critical role in ensuring the precision and efficiency of the fabrication processes. Raws li thev naus laus zis, semiconduct kev lag luam txuas ntxiv rau kev txhim kho hauv cov kev txhawj xeeb txog kev nyab xeeb thiab kev txhawj xeeb ib puag ncig thiab kev siv.